AI data centre demand is overwhelming memory supply, sending DRAM and NAND prices soaring and lifting Korean chip stocks — ...
Designing and deploying DSPs FPGAs aren’t the only programmable hardware option, or the only option challenged by AI. While AI makes it easier to design DSPs, there are rising complexities due to the ...
AI-driven innovative technology brand TECNO is set to unveil its groundbreaking Modular Magnetic Interconnection Technology at MWC 2026. This concept, embodied by TECNO Modular Phone, represents TECNO ...
Adaptive camouflage integrates sensors and display technology to enhance stealth, addressing challenges in military and civilian security applications.
Broadcom (AVGO) said that it expects to sell at least 1M chips by 2027 based on its stacked design technology.
Q4 2025 earnings call recap: record $2.2B order book, APA integration, and 2026 revenue/EBITDA outlook—read now.
Callosum, founded by two Cambridge-trained neuroscientists and inspired in part by the brain, has a system for optimizing ...
By Max A. Cherney SAN JOSE, California, Feb 26 (Reuters) - Artificial intelligence chip designer Broadcom said that it expects to sell at least 1 million chips by 2027 based on its stacked design tech ...
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