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AI-based model measures atomic defects in materials
In biology, defects are generally bad. But in materials science, defects can be intentionally tuned to give materials useful ...
A new model measures defects that can be leveraged to improve materials' mechanical strength, heat transfer, and ...
Within the context of semiconductor inspection and failure analysis, latent defects present a significant challenge because they make it difficult to determine whether a fault originated during ...
Photo-induced force microscopy (PiFM) is a sophisticated nanoscale characterization approach that combines the elevated spatial resolution of atomic force microscopy (AFM) with infrared (IR) ...
At the 2025 PDF Solutions Users Conference, CEO John Kibarian delivered a wide-ranging keynote that positioned the semiconductor industry at a pivotal inflection point, one driven by explosive AI ...
Ensuring the reliability of multi-die assemblies requires a variety of approaches to detect subsurface defects. Bonds and interconnects are especially problematic and require more inspection ...
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