This wideband capability allows engineers to address diverse applications including broadband RF and microwave component ...

What methods can be applied to verify PCB functionality and safety? Which are suitable for mass production and for prototypes? What parameters are checked in each test? How to check a PCB without ...

LONDON--(BUSINESS WIRE)--The new automated test equipment market research from Technavio indicates Negative growth in the short term as the business impact of COVID-19 spreads. Get detailed insights ...

- Line to enable high-precision, high-definition circuit and 1.4-times increase in production capacity - Semiconductors have been evolving dramatically, with increased functionality, reduced size, ...

Device power supply (DPS) ICs have flexible force voltage and force current capacities to provide dynamic test capabilities to automated test equipment (ATE). The DPS IC is a voltage source when the ...

Recore 3D printer board developer [Elias Bakken] has posted about the automatic test procedure he developed using a stack-up of four (at least) pieces of vintage HP test equipment. In addition, his ...

The design stage of a product’s life cycle is arguably one of the most crucial decision making periods, as 70 to 80 percent of the overall manufacturing cost can be projected at this stage. Engineers ...

For automated test equipment (ATE) developers, addressing complexity is their specialty. It is no simple chore to keep the systems on a variety of legacy and new military aircraft bristling with ...

In 2019, automated test and airborne data loading technology is being disrupted by the introduction of never seen before technological concepts, including the world’s first cockpit control panel robot ...

Printed circuit board testing has been around as long as printed circuit boards, also known as printed circuit assemblies and printed wiring boards. PCB technology started in the early 20th century ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...