Ansys Inc has announced a first milestone in coupling Ansys and Ansoft products, successfully performing multiphysics simulations that involve electromagnetic applications. The simulations target ...

ANSYS Inc ANSS, TSMC and Microsoft MSFT have successfully tested a solution that enhances the simulation and analysis process of silicon Photonic Integrated Circuits (PICs). The joined forces have ...

Ansys (NASDAQ: ANSS) achieved certification of its cutting-edge multiphysics signoff solutions for TSMC’s advanced N3 and N4 process technologies. This enables joint customers to meet critical power, ...

Getting it right the first time isn’t just a good idea; in manufacturing it’s good business. A few attempts at creation can hold up production, driving up costs and time while tying up expensive ...

PITTSBURGH, Feb. 9, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) is extending its long-term strategic collaboration with Microsoft to accelerate virtual product design through expanded cloud-based access ...

Ansys announced that it has obtained certification for thermal and multiphysics verification tools for advanced semiconductor designs manufactured using Intel's 18A (1.8-nanometer) process technology.

PITTSBURGH, PA, March 26, 2021 – Global Unichip Corporation (GUC) is adopting a groundbreaking simulation workflow developed by Ansys (NASDAQ: ANSS) to accelerate Advanced-IC design. The workflow ...

PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...

One of the biggest problems with modeling anything, whether a business, a factory, or a new product, is connecting simulations across domains. Multiple kinds of experts need to come together to ...